Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

RS Stock No.: 707-3364Brand: BergquistManufacturers Part No.: SPK6-0.006-00-104
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Technical documents

Specifications

Dimensions

25.4 x 19.05mm

Thickness

0.152mm

Length

25.4mm

Width

19.05mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K6

Operating Temperature Range

-60 → +180 °C

Product details

Sil Pad® K6

Medium performance Kapton® based insulator
Thermal impedance 0.49°C-in2/W @50 psi
Tough dielectric carrier against cut-through
Colour Bluegreen
Flame rating VTM-O

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P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Stock information temporarily unavailable.

Technical documents

Specifications

Dimensions

25.4 x 19.05mm

Thickness

0.152mm

Length

25.4mm

Width

19.05mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K6

Operating Temperature Range

-60 → +180 °C

Product details

Sil Pad® K6

Medium performance Kapton® based insulator
Thermal impedance 0.49°C-in2/W @50 psi
Tough dielectric carrier against cut-through
Colour Bluegreen
Flame rating VTM-O