MG Chemicals 8331S Liquid Adhesive, 15 g
Technical documents
Specifications
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8331S
Application
Thermal Management
Material Compatibility
Metal, Plastic
Product Form
Liquid
Package Type
Syringe
Package Size
15 g
Cure Time
50 min
Maximum Operating Temperature
+150°C
Operating Temperature Range
-40 → +150 °C
Chemical Composition
Epoxy Resin
Minimum Operating Temperature
-40°C
Country of Origin
Canada
Product details
MG Chemical 8331 Slow Cure Conductive Epoxy Adhesive
The two-part MG Chemicals 8331S is an economical, slow cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding.
Features and Benefits
Easy 1: 1 mix ratio
Resists thermal and mechanical shocks
Provides the low resistivity needed for many operating conditions
Adheres to most electronic substrates
Strong water and chemical resistance
Effective at filling in seems between your metal plates.
To cure the adhesive faster, you can use higher temperatures up to 150°C
Typical Application
The primary applications for the 8331 are repair and assembly of your electronics in microelectronics and optoelectronics. It is used in the automobile, aerospace, marine communication, instrumentation, and industrial control equipment industries.
Bond electronic devices, repair defective traces and create jumpers on circuit boards
Stock information temporarily unavailable.
Please check again later.
P.O.A.
1
P.O.A.
1
Technical documents
Specifications
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8331S
Application
Thermal Management
Material Compatibility
Metal, Plastic
Product Form
Liquid
Package Type
Syringe
Package Size
15 g
Cure Time
50 min
Maximum Operating Temperature
+150°C
Operating Temperature Range
-40 → +150 °C
Chemical Composition
Epoxy Resin
Minimum Operating Temperature
-40°C
Country of Origin
Canada
Product details
MG Chemical 8331 Slow Cure Conductive Epoxy Adhesive
The two-part MG Chemicals 8331S is an economical, slow cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding.
Features and Benefits
Easy 1: 1 mix ratio
Resists thermal and mechanical shocks
Provides the low resistivity needed for many operating conditions
Adheres to most electronic substrates
Strong water and chemical resistance
Effective at filling in seems between your metal plates.
To cure the adhesive faster, you can use higher temperatures up to 150°C
Typical Application
The primary applications for the 8331 are repair and assembly of your electronics in microelectronics and optoelectronics. It is used in the automobile, aerospace, marine communication, instrumentation, and industrial control equipment industries.
Bond electronic devices, repair defective traces and create jumpers on circuit boards