Panasonic Roller Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SP-CO, IP67

RS Stock No.: 699-0066Brand: PanasonicManufacturers Part No.: ABS561640
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Technical documents

Specifications

Actuator Type

Roller Lever

Terminal Type

Through Hole

Contact Current Rating

2 A @ 30 V dc

Contact Configuration

SP-CO

IP Rating

IP67

Operating Force

0.39 N

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Contact Material

Silver Nickel Alloy

Mechanical Life

5 x 10^6Operations

Release Force

0.034N

Operating Temperature Range

-40 → +85°C

Country of Origin

Japan

Product details

ABS Type Sub-miniature Turquoise Microswitch

These sealed subminiature micro switches are only 19.8 x 11.1 x 6.4 mm in size and have a high environmental resistance. Typical applications include home appliances and automotive electrical systems.

Subminiature size
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type

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P.O.A.

Panasonic Roller Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SP-CO, IP67

P.O.A.

Panasonic Roller Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SP-CO, IP67
Stock information temporarily unavailable.

Technical documents

Specifications

Actuator Type

Roller Lever

Terminal Type

Through Hole

Contact Current Rating

2 A @ 30 V dc

Contact Configuration

SP-CO

IP Rating

IP67

Operating Force

0.39 N

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Contact Material

Silver Nickel Alloy

Mechanical Life

5 x 10^6Operations

Release Force

0.034N

Operating Temperature Range

-40 → +85°C

Country of Origin

Japan

Product details

ABS Type Sub-miniature Turquoise Microswitch

These sealed subminiature micro switches are only 19.8 x 11.1 x 6.4 mm in size and have a high environmental resistance. Typical applications include home appliances and automotive electrical systems.

Subminiature size
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type