Nichicon 3300μF Electrolytic Capacitor 6.3V dc, Through Hole - UVR0J332MPD

RS Stock No.: 862-3046Brand: NichiconManufacturers Part No.: UVR0J332MPDIMPA: 0
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Technical documents

Specifications

Dimensions (L x W x H)

94 x 94 x45mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Lifetime

2000h

Mounting Type

Through Hole

Lead Pitch

5mm

Diameter

10mm

Voltage

6.3V dc

Tolerance

±20%

Height

20mm

Ripple Current

1.19A

Capacitance

3300µF

Series

VR

Leakage Current

623.7 μA

Dimensions

10 x 20mm

Country of Origin

Japan

Product details

Kinetis L Series Microcontrollers

Kinetis L series microcontrollers combine the exceptional energy-efficiency and ease-of-use of the ARM Cortex-M0+ processor core with the performance, peripheral sets and scalability of the Kinetis 32-bit range. Kinetis L series microcontrollers are also hardware and software compatible with the Cortex-M4-based Kinetis K series, providing a scalable migration path to more performance, memory and feature integration.

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P.O.A.

Nichicon 3300μF Electrolytic Capacitor 6.3V dc, Through Hole - UVR0J332MPD

P.O.A.

Nichicon 3300μF Electrolytic Capacitor 6.3V dc, Through Hole - UVR0J332MPD
Stock information temporarily unavailable.

Technical documents

Specifications

Dimensions (L x W x H)

94 x 94 x45mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Lifetime

2000h

Mounting Type

Through Hole

Lead Pitch

5mm

Diameter

10mm

Voltage

6.3V dc

Tolerance

±20%

Height

20mm

Ripple Current

1.19A

Capacitance

3300µF

Series

VR

Leakage Current

623.7 μA

Dimensions

10 x 20mm

Country of Origin

Japan

Product details

Kinetis L Series Microcontrollers

Kinetis L series microcontrollers combine the exceptional energy-efficiency and ease-of-use of the ARM Cortex-M0+ processor core with the performance, peripheral sets and scalability of the Kinetis 32-bit range. Kinetis L series microcontrollers are also hardware and software compatible with the Cortex-M4-based Kinetis K series, providing a scalable migration path to more performance, memory and feature integration.