TDK, SPM-LR, 3015 Shielded Wire-wound SMD Inductor with a Metal Core, 2.2 μH ±20% Wire-Wound 2.8A Idc
Technical documents
Specifications
Brand
TDKInductance
2.2 μH
Maximum dc Current
2.8A
Package/Case
3015
Length
3.2mm
Depth
3mm
Height
1.5mm
Dimensions
3.2 x 3 x 1.5mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
86.6mΩ
Series
SPM-LR
Core Material
Metal
Minimum Operating Temperature
-40°C
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Moulded
Yes
Country of Origin
China
Product details
SMP3015 Series Magnetically Shielded Wire Wound Inductors
TDK SPM3015 series wire wound surface mount inductors are a low profile product that are magnetically shielded for power circuits. These wire wound inductors achieve large current, low Rdc and compactness. These surface mount inductors have low inductance variance in high temperature environments with good superimposition characteristics. Metallic magnetic material used in the structure leads to a hum noise lower than with core adhesive coils.
Applications
Compact power supply modules
Tablet terminals
Note PCs
HDDs
Servers
TDK Non Standard SMT Inductors (Chokes)
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P.O.A.
10
P.O.A.
10
Technical documents
Specifications
Brand
TDKInductance
2.2 μH
Maximum dc Current
2.8A
Package/Case
3015
Length
3.2mm
Depth
3mm
Height
1.5mm
Dimensions
3.2 x 3 x 1.5mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
86.6mΩ
Series
SPM-LR
Core Material
Metal
Minimum Operating Temperature
-40°C
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Moulded
Yes
Country of Origin
China
Product details
SMP3015 Series Magnetically Shielded Wire Wound Inductors
TDK SPM3015 series wire wound surface mount inductors are a low profile product that are magnetically shielded for power circuits. These wire wound inductors achieve large current, low Rdc and compactness. These surface mount inductors have low inductance variance in high temperature environments with good superimposition characteristics. Metallic magnetic material used in the structure leads to a hum noise lower than with core adhesive coils.
Applications
Compact power supply modules
Tablet terminals
Note PCs
HDDs
Servers