Winslow Straight Through Hole Mount 15.24 mm, 2.54 mm Pitch IC Socket Adapter, 28 Pin Female DIP to 28 Pin Male DIP

RS Stock No.: 158-3045Brand: WinslowManufacturers Part No.: W9116RC
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Technical documents

Specifications

Brand

Winslow

Pitch

15.24 mm, 2.54 mm

End 1

28 Pin Female DIP

End 2

28 Pin Male DIP

End 1 Number of Contacts

28

End 2 Number of Contacts

28

End 1 Type

DIP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Housing Material

FR4

Country of Origin

United Kingdom

Product details

DIP Expansion & Reduction Sockets

'Adaptics' that convert dual in line packages from one pitch to another pitch.

PCB: Epoxy Fibreglass FR4

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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P.O.A.

Winslow Straight Through Hole Mount 15.24 mm, 2.54 mm Pitch IC Socket Adapter, 28 Pin Female DIP to 28 Pin Male DIP

P.O.A.

Winslow Straight Through Hole Mount 15.24 mm, 2.54 mm Pitch IC Socket Adapter, 28 Pin Female DIP to 28 Pin Male DIP
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 9P.O.A.
10 - 24P.O.A.
25 - 49P.O.A.
50 - 99P.O.A.
100+P.O.A.

Technical documents

Specifications

Brand

Winslow

Pitch

15.24 mm, 2.54 mm

End 1

28 Pin Female DIP

End 2

28 Pin Male DIP

End 1 Number of Contacts

28

End 2 Number of Contacts

28

End 1 Type

DIP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Housing Material

FR4

Country of Origin

United Kingdom

Product details

DIP Expansion & Reduction Sockets

'Adaptics' that convert dual in line packages from one pitch to another pitch.

PCB: Epoxy Fibreglass FR4

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.