Winslow Straight Through Hole Mount 1.27 mm, 15.24 mm Pitch IC Socket Adapter, 28 Pin Female DIP to 32 Pin Male PLCC
Technical documents
Specifications
Brand
WinslowPitch
1.27 mm, 15.24 mm
End 1
28 Pin Female DIP
End 2
32 Pin Male PLCC
End 1 Number of Contacts
28
End 2 Number of Contacts
32
End 1 Type
DIP
End 2 Type
PLCC
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Beryllium Copper, Brass
Contact Plating
Gold, Tin
Housing Material
FR4
Country of Origin
United Kingdom
Product details
DIP to PLCC Sockets
DIP to PLCC 'Adaptics' which emulates PLCC devices with standard dual in line packages. Also, can be used to convert PLCC to dual in line package in times of product shortage or redesign.
Plug body: Glass Filled Polyester
Temperature rating: +105°C
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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P.O.A.
1
P.O.A.
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | P.O.A. |
| 10 - 24 | P.O.A. |
| 25 - 49 | P.O.A. |
| 50 - 99 | P.O.A. |
| 100+ | P.O.A. |
Technical documents
Specifications
Brand
WinslowPitch
1.27 mm, 15.24 mm
End 1
28 Pin Female DIP
End 2
32 Pin Male PLCC
End 1 Number of Contacts
28
End 2 Number of Contacts
32
End 1 Type
DIP
End 2 Type
PLCC
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Beryllium Copper, Brass
Contact Plating
Gold, Tin
Housing Material
FR4
Country of Origin
United Kingdom
Product details
DIP to PLCC Sockets
DIP to PLCC 'Adaptics' which emulates PLCC devices with standard dual in line packages. Also, can be used to convert PLCC to dual in line package in times of product shortage or redesign.
Plug body: Glass Filled Polyester
Temperature rating: +105°C
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.