Condition Monitoring
What is Condition Monitoring
Condition monitoring (CM) is the procedure of monitoring conditions in machinery (such as vibration and temperature) to measure changes and variations that can confirm a developing fault. Condition monitoring allows for maintenance to be scheduled accordingly to prevent failure and subsequent unplanned downtime.
The state-of-the-art machine monitoring ...
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1
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BALLUFF
Vibration Velocity, Vibration Acceleration, Vibration Severity Zone, Contact Temperature, Relative Humidity, Ambient Pressure, Sensor Self-Awareness
Yes
IO-Link
IO-LINK
Analog/Digital
-
Real Time
No
-
IP67
Direct Screw Mounting, Magnetic Base Option
Yes
BCM
-
P.O.A.
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1
BALLUFF
Vibration Velocity, Vibration Acceleration, Vibration Severity Zone, Contact Temperature, Sensor Self-Awareness
Yes
-
IO-LINK
Analog/Digital
-
Real Time
No
-
IP67, IP68, IP69K
Direct Screw Mounting, Magnetic Base Option
Yes
BCM
-
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Omron
Temperature
Yes
Ethernet
Ethernet, Others
Digital
Transistor
Real Time
-
-10 → +55
-
DIN Rail
No
K6PM
Contact
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1
Omron
Temperature
Yes
Ethernet
Ethernet, Others
Digital
Transistor
Real Time
-
-10 → +55
-
DIN Rail
No
K6PM
Contact
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1
Sick
Vibration Monitoring, vibration analysis, contact temperature & shock
Yes
IO-Link
IO-LINK
-
2 x switching outputs
-
Yes
± 8 g
IP68
Direct Screw Mounting
No
MPB10
Analoge/Digital
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1