TDK, VLS-E, 3015 Shielded Wire-wound SMD Inductor with a Ferrite Core, 2.2 μH ±20% Shielded 1.75A Idc
Technical documents
Specifications
Brand
TDKInductance
2.2 μH
Maximum dc Current
1.75A
Package/Case
3015
Length
3mm
Depth
3mm
Height
1.5mm
Dimensions
3 x 3 x 1.5mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
84mΩ
Series
VLS-E
Core Material
Ferrite
Minimum Operating Temperature
-40°C
Inductor Construction
Shielded
Maximum Operating Temperature
+105°C
Country of Origin
Japan
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
P.O.A.
1
P.O.A.
1
Stock information temporarily unavailable.
Please check again later.
Technical documents
Specifications
Brand
TDKInductance
2.2 μH
Maximum dc Current
1.75A
Package/Case
3015
Length
3mm
Depth
3mm
Height
1.5mm
Dimensions
3 x 3 x 1.5mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
84mΩ
Series
VLS-E
Core Material
Ferrite
Minimum Operating Temperature
-40°C
Inductor Construction
Shielded
Maximum Operating Temperature
+105°C
Country of Origin
Japan
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules