RS PRO Amber PUR Potting Compound 350 g
Technical documents
Specifications
Brand
RS ProProduct Material
PUR
Package Type
Pack
Package Size
350 g
Special Properties
Water Resistance
Cure Time
24 h
Hardness
60 Shore A
Thermal Conductivity
0.25W/mK
Colour
Amber
Maximum Operating Temperature
+120°C
Minimum Operating Temperature
-50°C
Operating Temperature Range
-50 → +120 °C
Viscosity Measurement
550 mPa/s at +25°C
Physical Form
Viscous Liquid
Odour
Musty
Country of Origin
United Kingdom
Product details
RS Pro Polyurethane Potting Compound
A flexible but tough potting compound which adheres to most surfaces.The material's low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C; ,0.25 hours @100°C
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.
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P.O.A.
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P.O.A.
1
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Technical documents
Specifications
Brand
RS ProProduct Material
PUR
Package Type
Pack
Package Size
350 g
Special Properties
Water Resistance
Cure Time
24 h
Hardness
60 Shore A
Thermal Conductivity
0.25W/mK
Colour
Amber
Maximum Operating Temperature
+120°C
Minimum Operating Temperature
-50°C
Operating Temperature Range
-50 → +120 °C
Viscosity Measurement
550 mPa/s at +25°C
Physical Form
Viscous Liquid
Odour
Musty
Country of Origin
United Kingdom
Product details
RS Pro Polyurethane Potting Compound
A flexible but tough potting compound which adheres to most surfaces.The material's low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C; ,0.25 hours @100°C
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.