Technical documents
Specifications
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
120Ω
Current Rating
400mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Maximum DC Resistance
0.30Ω
Application
Signal Line
Material
D
Series
MMZ
Product details
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
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P.O.A.
Standard
100
P.O.A.
Standard
100
Technical documents
Specifications
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
120Ω
Current Rating
400mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Maximum DC Resistance
0.30Ω
Application
Signal Line
Material
D
Series
MMZ
Product details
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc