Technical documents
Specifications
Brand
E-TECSeries
SIB
Pitch
2.54mm
Number Of Contacts
32
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Beryllium Copper
Current Rating
1.0A
Product details
Wire-Wrap Slotted Header
0.1in. (2.54mm) pitch snappable 32 way wire-wrap headers
Can provide up to 3 wrapping cycles
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Technical documents
Specifications
Brand
E-TECSeries
SIB
Pitch
2.54mm
Number Of Contacts
32
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Beryllium Copper
Current Rating
1.0A
Product details
Wire-Wrap Slotted Header
0.1in. (2.54mm) pitch snappable 32 way wire-wrap headers
Can provide up to 3 wrapping cycles