Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 48 to DIP 48

RS Stock No.: 741-9451Brand: WinslowManufacturers Part No.: W9574RC
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Technical documents

Specifications

Brand

Winslow

Pitch

0.5 mm, 2.54 mm

End 1

TSSOP 48

End 2

DIP 48

End 1 Number of Contacts

48

End 2 Number of Contacts

48

End 1 Type

TSSOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors

'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

Stock information temporarily unavailable.

P.O.A.

Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 48 to DIP 48

P.O.A.

Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 48 to DIP 48
Stock information temporarily unavailable.

Stock information temporarily unavailable.

Please check again later.

Technical documents

Specifications

Brand

Winslow

Pitch

0.5 mm, 2.54 mm

End 1

TSSOP 48

End 2

DIP 48

End 1 Number of Contacts

48

End 2 Number of Contacts

48

End 1 Type

TSSOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors

'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.