Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 44 Pin Female PLCC to 44 Pin Male PGA

RS Stock No.: 741-9313Brand: WinslowManufacturers Part No.: WA044127DSAJTRC
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Technical documents

Specifications

Brand

Winslow

Pitch

1.27 mm, 2.54 mm

End 1

44 Pin Female PLCC

End 2

44 Pin Male PGA

End 1 Number of Contacts

44

End 2 Number of Contacts

44

End 1 Type

PLCC

End 2 Type

PGA

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Country of Origin

United Kingdom

Product details

PLCC Socket to PGA Pin Adapters

These Winslow Adaptics PLCC Socket to PGA Adapters have a through hole footprint with a 3.2mm above board height.

IC Sockets-Package Adaptics

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

P.O.A.

Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 44 Pin Female PLCC to 44 Pin Male PGA

P.O.A.

Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 44 Pin Female PLCC to 44 Pin Male PGA

Stock information temporarily unavailable.

Stock information temporarily unavailable.

Technical documents

Specifications

Brand

Winslow

Pitch

1.27 mm, 2.54 mm

End 1

44 Pin Female PLCC

End 2

44 Pin Male PGA

End 1 Number of Contacts

44

End 2 Number of Contacts

44

End 1 Type

PLCC

End 2 Type

PGA

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Country of Origin

United Kingdom

Product details

PLCC Socket to PGA Pin Adapters

These Winslow Adaptics PLCC Socket to PGA Adapters have a through hole footprint with a 3.2mm above board height.

IC Sockets-Package Adaptics

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.