Amphenol Communications Solutions 10090770 26 Way Straight 2.29 mm Pitch Panel D-Sub Connector Female
Technical documents
Specifications
Number of Contacts
26
Product Type
D-Sub Connector
Current
2.5A
Orientation
Straight
Mount Type
Panel
Connector Gender
Female
Connector Type D
D-Sub
D-Sub Shell Size
A
Housing Material
Steel
Voltage
250 V
Minimum Operating Temperature
-55°C
Termination Type
Solder
Contact Gender
Female
Maximum Operating Temperature
105°C
Standards/Approvals
No
Series
10090770
Contact Material
Copper Alloy
Contact Plating
Gold over Nickel
Pitch
2.29mm
Country of Origin
China
Product details
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
These HD D-Sub connectors are Panel mount with standard Ø3.1 mm holes and have solder bucket cable termination.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
Stock information temporarily unavailable.
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Technical documents
Specifications
Number of Contacts
26
Product Type
D-Sub Connector
Current
2.5A
Orientation
Straight
Mount Type
Panel
Connector Gender
Female
Connector Type D
D-Sub
D-Sub Shell Size
A
Housing Material
Steel
Voltage
250 V
Minimum Operating Temperature
-55°C
Termination Type
Solder
Contact Gender
Female
Maximum Operating Temperature
105°C
Standards/Approvals
No
Series
10090770
Contact Material
Copper Alloy
Contact Plating
Gold over Nickel
Pitch
2.29mm
Country of Origin
China
Product details
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
These HD D-Sub connectors are Panel mount with standard Ø3.1 mm holes and have solder bucket cable termination.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.