Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2W/m·K, Gap Pad 2200SF, 100 x 100mm

RS Stock No.: 752-4840Brand: BergquistManufacturers Part No.: GP2200SF-0.020-02-00-100x100
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Technical documents

Specifications

Dimensions

100 x 100mm

Thickness

0.02in

Length

100mm

Width

100mm

Thermal Conductivity

2W/m·K

Material

Gap Pad 2200SF

Self-Adhesive

Yes

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+125°C

Hardness

Shore OO 70

Material Trade Name

Gap Pad 2200SF

Operating Temperature Range

-60 → +125 °C

Country of Origin

United States

Product details

Gap Pad® 2200SF

Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules.

Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating

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P.O.A.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2W/m·K, Gap Pad 2200SF, 100 x 100mm

P.O.A.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2W/m·K, Gap Pad 2200SF, 100 x 100mm
Stock information temporarily unavailable.

Technical documents

Specifications

Dimensions

100 x 100mm

Thickness

0.02in

Length

100mm

Width

100mm

Thermal Conductivity

2W/m·K

Material

Gap Pad 2200SF

Self-Adhesive

Yes

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+125°C

Hardness

Shore OO 70

Material Trade Name

Gap Pad 2200SF

Operating Temperature Range

-60 → +125 °C

Country of Origin

United States

Product details

Gap Pad® 2200SF

Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules.

Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating