BI Technologies, HM76, 30 Wire-wound SMD Inductor 100 μH ±20% Wire-Wound 1.5A Idc
Technical documents
Specifications
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C
Stock information temporarily unavailable.
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Technical documents
Specifications
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C