Heatsink, Clip, 35 x 35 x 25mm, Clip
Technical documents
Specifications
Brand
MalicoFor Use With
Clip
Length
35mm
Width
35mm
Height
25mm
Dimensions
35 x 35 x 25mm
Mounting
Clip
Colour
Black
Country of Origin
Taiwan, Province Of China
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
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P.O.A.
1
P.O.A.
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 24 | P.O.A. |
| 25 - 99 | P.O.A. |
| 100 - 249 | P.O.A. |
| 250+ | P.O.A. |
Technical documents
Specifications
Brand
MalicoFor Use With
Clip
Length
35mm
Width
35mm
Height
25mm
Dimensions
35 x 35 x 25mm
Mounting
Clip
Colour
Black
Country of Origin
Taiwan, Province Of China
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop