Murata, LQH32MN, 1210 (3225M) Unshielded Wire-wound SMD Inductor with a Ferrite Core Core, 2.2 μH ±10% Wire-Wound 370mA

RS Stock No.: 167-5900Brand: MurataManufacturers Part No.: LQH32MN2R2K23L
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Technical documents

Specifications

Brand

Murata

Inductance

2.2 μH

Maximum dc Current

370mA

Package/Case

1210 (3225M)

Length

3.2mm

Depth

2.5mm

Height

2mm

Dimensions

3.2 x 2.5 x 2mm

Shielded

No

Tolerance

±10%

Maximum DC Resistance

800mΩ

Series

LQH32MN

Core Material

Ferrite Core

Maximum Self Resonant Frequency

50MHz

Minimum Operating Temperature

-40°C

Minimum Quality Factor

20

Inductor Construction

Wire-Wound

Maximum Operating Temperature

+85°C

Country of Origin

Japan

Product details

Murata 1210 LQH32MN Series Wire Wound Inductor

Subminiature coil inductors with ferrite core for general use.
High quality and low DC resistance.
These chips are ideal for increasing the performance of electronic circuits in video, communications, audio equipment and mobile telephones.

P.O.A.

Murata, LQH32MN, 1210 (3225M) Unshielded Wire-wound SMD Inductor with a Ferrite Core Core, 2.2 μH ±10% Wire-Wound 370mA

P.O.A.

Murata, LQH32MN, 1210 (3225M) Unshielded Wire-wound SMD Inductor with a Ferrite Core Core, 2.2 μH ±10% Wire-Wound 370mA

Stock information temporarily unavailable.

Stock information temporarily unavailable.

Technical documents

Specifications

Brand

Murata

Inductance

2.2 μH

Maximum dc Current

370mA

Package/Case

1210 (3225M)

Length

3.2mm

Depth

2.5mm

Height

2mm

Dimensions

3.2 x 2.5 x 2mm

Shielded

No

Tolerance

±10%

Maximum DC Resistance

800mΩ

Series

LQH32MN

Core Material

Ferrite Core

Maximum Self Resonant Frequency

50MHz

Minimum Operating Temperature

-40°C

Minimum Quality Factor

20

Inductor Construction

Wire-Wound

Maximum Operating Temperature

+85°C

Country of Origin

Japan

Product details

Murata 1210 LQH32MN Series Wire Wound Inductor

Subminiature coil inductors with ferrite core for general use.
High quality and low DC resistance.
These chips are ideal for increasing the performance of electronic circuits in video, communications, audio equipment and mobile telephones.