Technical documents
Specifications
Brand
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Mounting Type
Surface Mount
Package Type
SLP EP
Maximum Reverse Stand-off Voltage
12V
Pin Count
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Maximum Operating Temperature
+125 °C
Dimensions
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Height
0.47mm
Width
0.6mm
Test Current
1mA
Length
1mm
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Technical documents
Specifications
Brand
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Mounting Type
Surface Mount
Package Type
SLP EP
Maximum Reverse Stand-off Voltage
12V
Pin Count
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Maximum Operating Temperature
+125 °C
Dimensions
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Height
0.47mm
Width
0.6mm
Test Current
1mA
Length
1mm