Technical documents
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
39.3V
Minimum Breakdown Voltage
20V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
18V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
102A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm
Stock information temporarily unavailable.
P.O.A.
5
P.O.A.
Stock information temporarily unavailable.
5
| quantity | Unit price |
|---|---|
| 5 - 20 | P.O.A. |
| 25 - 95 | P.O.A. |
| 100 - 245 | P.O.A. |
| 250 - 495 | P.O.A. |
| 500+ | P.O.A. |
Technical documents
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
39.3V
Minimum Breakdown Voltage
20V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
18V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
102A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm
