STMicroelectronics ULN2801A 8 Eight Darlington array NPN, 500 mA 50 V HFE:1000, 18-Pin DIP
Technical documents
Specifications
Brand
STMicroelectronicsProduct Type
Eight Darlington array
Maximum Continuous Collector Current Ic
500mA
Maximum Collector Emitter Voltage Vceo
50V
Package Type
DIP
Mount Type
Through Hole
Pin Count
18
Number of Elements per Chip
8
Minimum DC Current Gain hFE
1000
Maximum Power Dissipation Pd
2.25W
Transistor Polarity
NPN
Minimum Operating Temperature
-20°C
Maximum Collector Emitter Saturation Voltage VceSAT
1.6V
Maximum Operating Temperature
150°C
Width
7.1 mm
Height
3.68mm
Length
23.24mm
Standards/Approvals
No
Series
ULN2801A
Automotive Standard
No
Product details
Darlington Transistor Arrays, STMicroelectronics
Darlington transistor power drivers are high-voltage, high-current switch arrays containing multiple open-collector Darlington pairs and integral suppression diodes for inductive loads. The high current rating of each output is 500 mA or higher. The inputs are pinned opposite the outputs in the IC package to simplify the application board layout. The interface is standard logic level for TTL or CMOS.
Darlington Transistor Drivers
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Technical documents
Specifications
Brand
STMicroelectronicsProduct Type
Eight Darlington array
Maximum Continuous Collector Current Ic
500mA
Maximum Collector Emitter Voltage Vceo
50V
Package Type
DIP
Mount Type
Through Hole
Pin Count
18
Number of Elements per Chip
8
Minimum DC Current Gain hFE
1000
Maximum Power Dissipation Pd
2.25W
Transistor Polarity
NPN
Minimum Operating Temperature
-20°C
Maximum Collector Emitter Saturation Voltage VceSAT
1.6V
Maximum Operating Temperature
150°C
Width
7.1 mm
Height
3.68mm
Length
23.24mm
Standards/Approvals
No
Series
ULN2801A
Automotive Standard
No
Product details
Darlington Transistor Arrays, STMicroelectronics
Darlington transistor power drivers are high-voltage, high-current switch arrays containing multiple open-collector Darlington pairs and integral suppression diodes for inductive loads. The high current rating of each output is 500 mA or higher. The inputs are pinned opposite the outputs in the IC package to simplify the application board layout. The interface is standard logic level for TTL or CMOS.