Syfer Technology 220pF Multilayer Ceramic Capacitor MLCC, 500V dc V, ±5% , SMD
Technical documents
Specifications
Brand
Syfer TechnologyCapacitance
220pF
Voltage
500V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
C0G, NP0
Tolerance
±5%
Dimensions
2 x 1.25 x 1.3mm
Length
2mm
Depth
1.25mm
Height
1.3mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 0805
FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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P.O.A.
Production pack (Reel)
10
P.O.A.
Production pack (Reel)
10
Technical documents
Specifications
Brand
Syfer TechnologyCapacitance
220pF
Voltage
500V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
C0G, NP0
Tolerance
±5%
Dimensions
2 x 1.25 x 1.3mm
Length
2mm
Depth
1.25mm
Height
1.3mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 0805
FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.