TDK Capacitor Array 1nF 50V dc ±20% 4-way C0G Dielectric , 1206 (3216M), CKC, Surface Mount

RS Stock No.: 780-4859Brand: TDKManufacturers Part No.: CKCA43C0G1H102K100AA
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Technical documents

Specifications

Brand

TDK

Capacitance

1nF

Series

CKC

Tolerance

±20%

Voltage

50V dc

Mounting Type

Surface Mount

Number of Capacitors

4

Dielectric

C0G

Package/Case

1206 (3216M)

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Tolerance Minus

-20%

Tolerance Plus

+20%

Product details

TDK SMT 1206 commercial grade array, CKC series

TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.

Features and Benefits:

Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package

Applications:

Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit

Network and Feed-through

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P.O.A.

TDK Capacitor Array 1nF 50V dc ±20% 4-way C0G Dielectric , 1206 (3216M), CKC, Surface Mount
Select packaging type

P.O.A.

TDK Capacitor Array 1nF 50V dc ±20% 4-way C0G Dielectric , 1206 (3216M), CKC, Surface Mount
Stock information temporarily unavailable.
Select packaging type

Technical documents

Specifications

Brand

TDK

Capacitance

1nF

Series

CKC

Tolerance

±20%

Voltage

50V dc

Mounting Type

Surface Mount

Number of Capacitors

4

Dielectric

C0G

Package/Case

1206 (3216M)

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Tolerance Minus

-20%

Tolerance Plus

+20%

Product details

TDK SMT 1206 commercial grade array, CKC series

TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.

Features and Benefits:

Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package

Applications:

Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit

Network and Feed-through