Technical documents
Specifications
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
2500Ω
Current Rating
200mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Maximum DC Resistance
0.80Ω
Height
0.8mm
Application
Signal Line
Series
MMZ
Material
A
Country of Origin
Japan
Product details
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Technical documents
Specifications
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
2500Ω
Current Rating
200mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Maximum DC Resistance
0.80Ω
Height
0.8mm
Application
Signal Line
Series
MMZ
Material
A
Country of Origin
Japan
Product details
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
