TDK Ferrite Bead (Chip Bead), 1.6 x 0.8 x 0.8mm (0603 (1608M)), 300Ω impedance at 100 MHz

RS Stock No.: 741-3122Brand: TDKManufacturers Part No.: MMZ1608D301BT
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Technical documents

Specifications

Brand

TDK

Package Type

0603 (1608M)

Impedance at 100 MHz

300Ω

Current Rating

300mA

Type

Chip Bead

Dimensions

1.6 x 0.8 x 0.8mm

Length

1.6mm

Depth

0.8mm

Height

0.8mm

Maximum DC Resistance

0.70Ω

Material

D

Series

MMZ

Application

Signal Line

Product details

Chip bead 0603 MMZ series

This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc

Stock information temporarily unavailable.

P.O.A.

TDK Ferrite Bead (Chip Bead), 1.6 x 0.8 x 0.8mm (0603 (1608M)), 300Ω impedance at 100 MHz

1

Available in multiples of 100
1P.O.A.
101P.O.A.
201P.O.A.
301P.O.A.
401P.O.A.
501P.O.A.
601P.O.A.
701P.O.A.
801P.O.A.
901P.O.A.
1001P.O.A.
1101P.O.A.
1201P.O.A.
1301P.O.A.
1401P.O.A.

P.O.A.

TDK Ferrite Bead (Chip Bead), 1.6 x 0.8 x 0.8mm (0603 (1608M)), 300Ω impedance at 100 MHz
Stock information temporarily unavailable.

1

Available in multiples of 100
1P.O.A.
101P.O.A.
201P.O.A.
301P.O.A.
401P.O.A.
501P.O.A.
601P.O.A.
701P.O.A.
801P.O.A.
901P.O.A.
1001P.O.A.
1101P.O.A.
1201P.O.A.
1301P.O.A.
1401P.O.A.

Stock information temporarily unavailable.

Please check again later.

Technical documents

Specifications

Brand

TDK

Package Type

0603 (1608M)

Impedance at 100 MHz

300Ω

Current Rating

300mA

Type

Chip Bead

Dimensions

1.6 x 0.8 x 0.8mm

Length

1.6mm

Depth

0.8mm

Height

0.8mm

Maximum DC Resistance

0.70Ω

Material

D

Series

MMZ

Application

Signal Line

Product details

Chip bead 0603 MMZ series

This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc