Technical documents
Specifications
Brand
TDKPackage Type
0805 (2012M)
Impedance at 100 MHz
180Ω
Current Rating
600mA
Type
Chip Bead
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Height
0.85mm
Maximum DC Resistance
0.15Ω
Material
S
Series
MMZ
Application
Signal Line
Product details
Chip bead 0805 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Technical documents
Specifications
Brand
TDKPackage Type
0805 (2012M)
Impedance at 100 MHz
180Ω
Current Rating
600mA
Type
Chip Bead
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Height
0.85mm
Maximum DC Resistance
0.15Ω
Material
S
Series
MMZ
Application
Signal Line
Product details
Chip bead 0805 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
