TDK Ferrite Bead (Chip Bead), 2 x 1.25 x 0.85mm (0805 (2012M)), 600Ω impedance at 100 MHz

RS Stock No.: 111-0869Brand: TDKManufacturers Part No.: MMZ2012S601AT000
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Technical documents

Specifications

Brand

TDK

Package Type

0805 (2012M)

Impedance at 100 MHz

600Ω

Current Rating

500mA

Type

Chip Bead

Dimensions

2 x 1.25 x 0.85mm

Length

2mm

Depth

1.25mm

Maximum DC Resistance

0.35Ω

Height

0.85mm

Application

Signal Line

Series

MMZ

Material

S

Country of Origin

Japan

Product details

Chip bead 0805 MMZ series

This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc

P.O.A.

TDK Ferrite Bead (Chip Bead), 2 x 1.25 x 0.85mm (0805 (2012M)), 600Ω impedance at 100 MHz

1

Available in multiples of 4000
1P.O.A.
4001P.O.A.
8001P.O.A.
12001P.O.A.
16001P.O.A.
20001P.O.A.
24001P.O.A.
28001P.O.A.
32001P.O.A.
36001P.O.A.
40001P.O.A.
44001P.O.A.
48001P.O.A.
52001P.O.A.
56001P.O.A.

P.O.A.

TDK Ferrite Bead (Chip Bead), 2 x 1.25 x 0.85mm (0805 (2012M)), 600Ω impedance at 100 MHz

Stock information temporarily unavailable.

1

Available in multiples of 4000
1P.O.A.
4001P.O.A.
8001P.O.A.
12001P.O.A.
16001P.O.A.
20001P.O.A.
24001P.O.A.
28001P.O.A.
32001P.O.A.
36001P.O.A.
40001P.O.A.
44001P.O.A.
48001P.O.A.
52001P.O.A.
56001P.O.A.

Stock information temporarily unavailable.

Technical documents

Specifications

Brand

TDK

Package Type

0805 (2012M)

Impedance at 100 MHz

600Ω

Current Rating

500mA

Type

Chip Bead

Dimensions

2 x 1.25 x 0.85mm

Length

2mm

Depth

1.25mm

Maximum DC Resistance

0.35Ω

Height

0.85mm

Application

Signal Line

Series

MMZ

Material

S

Country of Origin

Japan

Product details

Chip bead 0805 MMZ series

This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc