TDK, VLS-E, 4012 Shielded Wire-wound SMD Inductor with a Ferrite Core, 33 μH ±20% Wire-Wound 700mA Idc
Technical documents
Specifications
Brand
TDKInductance
33 μH
Maximum dc Current
700mA
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
804mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
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P.O.A.
5
P.O.A.
5
Technical documents
Specifications
Brand
TDKInductance
33 μH
Maximum dc Current
700mA
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
804mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules