TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

RS Stock No.: 165-0770Brand: TE ConnectivityManufacturers Part No.: 120954-1
brand-logo
View all in Backplane Connectors

Technical documents

Specifications

Brand

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Current Rating

16A

Termination Method

Press-Fit

Series

Z-PACK HM

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

P.O.A.

TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

1

Available in multiples of 38
1P.O.A.
39P.O.A.
77P.O.A.
115P.O.A.
153P.O.A.
191P.O.A.
229P.O.A.
267P.O.A.
305P.O.A.
343P.O.A.
381P.O.A.
419P.O.A.
457P.O.A.
495P.O.A.
533P.O.A.

P.O.A.

TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Stock information temporarily unavailable.

1

Available in multiples of 38
1P.O.A.
39P.O.A.
77P.O.A.
115P.O.A.
153P.O.A.
191P.O.A.
229P.O.A.
267P.O.A.
305P.O.A.
343P.O.A.
381P.O.A.
419P.O.A.
457P.O.A.
495P.O.A.
533P.O.A.

Stock information temporarily unavailable.

Technical documents

Specifications

Brand

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Current Rating

16A

Termination Method

Press-Fit

Series

Z-PACK HM

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.