Technical documents
Specifications
Brand
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Current
3A
Contact Plating
Gold
Minimum Wire Size AWG
24AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
20AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
18.03mm
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Stock information temporarily unavailable.
P.O.A.
Standard
100
P.O.A.
Stock information temporarily unavailable.
Standard
100
| quantity | Unit price |
|---|---|
| 100 - 1100 | P.O.A. |
| 1200 - 2400 | P.O.A. |
| 2500 - 4900 | P.O.A. |
| 5000 - 9900 | P.O.A. |
| 10000+ | P.O.A. |
Technical documents
Specifications
Brand
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Current
3A
Contact Plating
Gold
Minimum Wire Size AWG
24AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
20AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
18.03mm
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
