TE Connectivity, DIPLOMATE 800 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

RS Stock No.: 680-1537PBrand: TE ConnectivityManufacturers Part No.: 2-1571586-3
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Technical documents

Specifications

Number Of Contacts

14

Mounting Type

Through Hole

Pin Type

Turned

Pitch

2.54mm

Row Width

7.62mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Gold, Tin

Current Rating

3A

Orientation

Vertical

Length

17.78mm

Width

4.57mm

Depth

10.16mm

Dimensions

17.78 x 4.57 x 10.16mm

Series

DIPLOMATE 800

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

PCT

Contact Material

Beryllium Copper

Country of Origin

Switzerland

Stock information temporarily unavailable.

P.O.A.

Each (Supplied in a Bag) (ex VAT)

TE Connectivity, DIPLOMATE 800 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
Select packaging type

P.O.A.

Each (Supplied in a Bag) (ex VAT)

TE Connectivity, DIPLOMATE 800 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
Stock information temporarily unavailable.
Select packaging type

Stock information temporarily unavailable.

Please check again later.

Technical documents

Specifications

Number Of Contacts

14

Mounting Type

Through Hole

Pin Type

Turned

Pitch

2.54mm

Row Width

7.62mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Gold, Tin

Current Rating

3A

Orientation

Vertical

Length

17.78mm

Width

4.57mm

Depth

10.16mm

Dimensions

17.78 x 4.57 x 10.16mm

Series

DIPLOMATE 800

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

PCT

Contact Material

Beryllium Copper

Country of Origin

Switzerland