TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

RS Stock No.: 165-0967Brand: TE ConnectivityManufacturers Part No.: 5-5223955-2
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Technical documents

Specifications

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Country of Origin

China

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

P.O.A.

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

1

Available in multiples of 60
1P.O.A.
61P.O.A.
121P.O.A.
181P.O.A.
241P.O.A.
301P.O.A.
361P.O.A.
421P.O.A.
481P.O.A.
541P.O.A.
601P.O.A.
661P.O.A.
721P.O.A.
781P.O.A.
841P.O.A.

P.O.A.

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

Stock information temporarily unavailable.

1

Available in multiples of 60
1P.O.A.
61P.O.A.
121P.O.A.
181P.O.A.
241P.O.A.
301P.O.A.
361P.O.A.
421P.O.A.
481P.O.A.
541P.O.A.
601P.O.A.
661P.O.A.
721P.O.A.
781P.O.A.
841P.O.A.

Stock information temporarily unavailable.

Technical documents

Specifications

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Country of Origin

China

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.