TE Connectivity Backplane Connector Through Hole, 4, 250 V 10A

RS Stock No.: 164-4187Brand: TE ConnectivityManufacturers Part No.: 5223995-1Distrelec Article No.: 304-53-066
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Technical documents

Specifications

Brand

TE Connectivity

Pole Format

4

Product Type

Backplane Connector

Current

10A

Voltage

250 V

Connector Gender

Female

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Housing Material

Polyethylene Terephthalate

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

125°C

Contact Plating

Gold over Palladium Nickel over Nickel

Standards/Approvals

No

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Stock information temporarily unavailable.

P.O.A.

TE Connectivity Backplane Connector Through Hole, 4, 250 V 10A

1

Available in multiples of 46
1P.O.A.
47P.O.A.
93P.O.A.
139P.O.A.
185P.O.A.
231P.O.A.
277P.O.A.
323P.O.A.
369P.O.A.
415P.O.A.
461P.O.A.
507P.O.A.
553P.O.A.
599P.O.A.
645P.O.A.

P.O.A.

TE Connectivity Backplane Connector Through Hole, 4, 250 V 10A

Stock information temporarily unavailable.

1

Available in multiples of 46
1P.O.A.
47P.O.A.
93P.O.A.
139P.O.A.
185P.O.A.
231P.O.A.
277P.O.A.
323P.O.A.
369P.O.A.
415P.O.A.
461P.O.A.
507P.O.A.
553P.O.A.
599P.O.A.
645P.O.A.

Technical documents

Specifications

Brand

TE Connectivity

Pole Format

4

Product Type

Backplane Connector

Current

10A

Voltage

250 V

Connector Gender

Female

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Housing Material

Polyethylene Terephthalate

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

125°C

Contact Plating

Gold over Palladium Nickel over Nickel

Standards/Approvals

No

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.