TE Connectivity Backplane Connector Through Hole, 4, 250V 10A

RS Stock No.: 164-4187Brand: TE ConnectivityManufacturers Part No.: 5223995-1Distrelec Article No.: 304-53-066
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View all in Compact Power Connectors

Technical documents

Specifications

Brand

TE Connectivity

Pole Format

4

Product Type

Backplane Connector

Current

10A

Voltage

250V

Connector Gender

Female

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Housing Material

Polyethylene Terephthalate

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

125°C

Contact Plating

Gold over Palladium Nickel over Nickel

Standards/Approvals

No

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

View all in Compact Power Connectors

Stock information temporarily unavailable.

P.O.A.

TE Connectivity Backplane Connector Through Hole, 4, 250V 10A

1

Available in multiples of 46
1P.O.A.
47P.O.A.
93P.O.A.
139P.O.A.
185P.O.A.
231P.O.A.
277P.O.A.
323P.O.A.
369P.O.A.
415P.O.A.
461P.O.A.
507P.O.A.
553P.O.A.
599P.O.A.
645P.O.A.

P.O.A.

TE Connectivity Backplane Connector Through Hole, 4, 250V 10A

Stock information temporarily unavailable.

1

Available in multiples of 46
1P.O.A.
47P.O.A.
93P.O.A.
139P.O.A.
185P.O.A.
231P.O.A.
277P.O.A.
323P.O.A.
369P.O.A.
415P.O.A.
461P.O.A.
507P.O.A.
553P.O.A.
599P.O.A.
645P.O.A.

Technical documents

Specifications

Brand

TE Connectivity

Pole Format

4

Product Type

Backplane Connector

Current

10A

Voltage

250V

Connector Gender

Female

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Housing Material

Polyethylene Terephthalate

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

125°C

Contact Plating

Gold over Palladium Nickel over Nickel

Standards/Approvals

No

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.