Technical documents
Specifications
Minimum Operating Temperature
-40 °C
Pin Count
16
Mounting Type
Surface Mount
Maximum Operating Temperature
+125 °C
Maximum Sink Current
800mA
Maximum Source Current
800mA
Minimum Operating Supply Voltage
1.8 V
Maximum Supply Current
3 mA
Height
0.9mm
Width
4.4mm
Length
5mm
Maximum Operating Supply Voltage
75 V
Package Type
TSSOP
Brand
Texas InstrumentsDimensions
5 x 4.4 x 0.9mm
Product details
RS Pro Low Density ESD Foam
RS Pro low density ESD foam provides pin and component protection to sensitive components. With its ESD properties youre safe to put any component on this foam. Its an effortless foam so you can just push your component onto the foam and know it will stay secure and not tumble around in packaging. This foam is soft and flexible and could ideally be used as soft packaging.
Standards
This conductive foam meets the surface resistance required as per EN 61340-5-1 (tested per IEC 61340-2-3)
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P.O.A.
Standard
1
P.O.A.
Standard
1
Technical documents
Specifications
Minimum Operating Temperature
-40 °C
Pin Count
16
Mounting Type
Surface Mount
Maximum Operating Temperature
+125 °C
Maximum Sink Current
800mA
Maximum Source Current
800mA
Minimum Operating Supply Voltage
1.8 V
Maximum Supply Current
3 mA
Height
0.9mm
Width
4.4mm
Length
5mm
Maximum Operating Supply Voltage
75 V
Package Type
TSSOP
Brand
Texas InstrumentsDimensions
5 x 4.4 x 0.9mm
Product details
RS Pro Low Density ESD Foam
RS Pro low density ESD foam provides pin and component protection to sensitive components. With its ESD properties youre safe to put any component on this foam. Its an effortless foam so you can just push your component onto the foam and know it will stay secure and not tumble around in packaging. This foam is soft and flexible and could ideally be used as soft packaging.
Standards
This conductive foam meets the surface resistance required as per EN 61340-5-1 (tested per IEC 61340-2-3)