Winslow 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

RS Stock No.: 226-3900Brand: WinslowManufacturers Part No.: W30528/3SFTRC
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Technical documents

Specifications

Brand

Winslow

Number Of Contacts

28

Mounting Type

Through Hole

Pin Type

Turned

Pitch

2.54mm

Row Width

7.62mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Gold, Tin

Current Rating

3A

Orientation

Vertical

Length

35.48mm

Width

3.5mm

Depth

10.14mm

Dimensions

35.48 x 3.5 x 10.14mm

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

+150°C

Housing Material

PBT

Contact Material

Beryllium Copper

Country of Origin

United Kingdom

Product details

Ultra Low Profile Gold-Plated Contact DIL Sockets

These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).

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Please check again later.

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P.O.A.

Winslow 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

P.O.A.

Winslow 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 14P.O.A.
15 - 49P.O.A.
50 - 99P.O.A.
100 - 249P.O.A.
250+P.O.A.

Technical documents

Specifications

Brand

Winslow

Number Of Contacts

28

Mounting Type

Through Hole

Pin Type

Turned

Pitch

2.54mm

Row Width

7.62mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Gold, Tin

Current Rating

3A

Orientation

Vertical

Length

35.48mm

Width

3.5mm

Depth

10.14mm

Dimensions

35.48 x 3.5 x 10.14mm

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

+150°C

Housing Material

PBT

Contact Material

Beryllium Copper

Country of Origin

United Kingdom

Product details

Ultra Low Profile Gold-Plated Contact DIL Sockets

These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).