Amphenol ICC 44 Way Panel Mount D-sub Connector Socket, 2.29mm Pitch
Technical documents
Specifications
Brand
Amphenol ICCNumber Of Contacts
44
Gender
Female
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Termination Method
Solder
D-Sub Shell Size
B
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
53.04mm
Width
4.8mm
Depth
12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Dimensions
53.04 x 4.8 x 12.55mm
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Country of Origin
China
Product details
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
These HD D-Sub connectors are Panel mount with standard Ø3.1 mm holes and have solder bucket cable termination.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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P.O.A.
1
Technical documents
Specifications
Brand
Amphenol ICCNumber Of Contacts
44
Gender
Female
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Termination Method
Solder
D-Sub Shell Size
B
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
53.04mm
Width
4.8mm
Depth
12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Dimensions
53.04 x 4.8 x 12.55mm
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Country of Origin
China
Product details
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
These HD D-Sub connectors are Panel mount with standard Ø3.1 mm holes and have solder bucket cable termination.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.