TDK, MHQ-P, 0402 (1005M) Shielded Multilayer Surface Mount Inductor with a Ceramic Core, 700 pH ±0.1nH Multilayer 1.2A
Technical documents
Specifications
Brand
TDKInductance
700 pH
Maximum dc Current
1.2A
Package/Case
0402 (1005M)
Length
1mm
Depth
0.6mm
Height
0.5mm
Dimensions
1 x 0.6 x 0.5mm
Shielded
Yes
Tolerance
±0.1nH
Maximum DC Resistance
30mΩ
Series
MHQ-P
Core Material
Ceramic
Maximum Self Resonant Frequency
18.3GHz
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Country of Origin
Japan
Product details
High Frequency Inductors - MHQ1005P Series
MHQ1005P series have a unique ceramic material and configuration which allows for the realisation of high Q characteristics that are equivalent to that of air core wound inductors.
Fine increments of inductance are achieved due to the multilayers
High Q characteristics
Fine increments of inductance
Applications include Smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , etc.), Bluetooth, W-LAN, UWB, tuners, and other high frequency circuits for the mobile communication industry
TDK Non Standard SMT Inductors (Chokes)
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P.O.A.
10000
P.O.A.
10000
Technical documents
Specifications
Brand
TDKInductance
700 pH
Maximum dc Current
1.2A
Package/Case
0402 (1005M)
Length
1mm
Depth
0.6mm
Height
0.5mm
Dimensions
1 x 0.6 x 0.5mm
Shielded
Yes
Tolerance
±0.1nH
Maximum DC Resistance
30mΩ
Series
MHQ-P
Core Material
Ceramic
Maximum Self Resonant Frequency
18.3GHz
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Country of Origin
Japan
Product details
High Frequency Inductors - MHQ1005P Series
MHQ1005P series have a unique ceramic material and configuration which allows for the realisation of high Q characteristics that are equivalent to that of air core wound inductors.
Fine increments of inductance are achieved due to the multilayers
High Q characteristics
Fine increments of inductance
Applications include Smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , etc.), Bluetooth, W-LAN, UWB, tuners, and other high frequency circuits for the mobile communication industry