Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold
Current Rating
3A
Orientation
Vertical
Length
50.8mm
Width
4.57mm
Depth
17.78mm
Dimensions
50.8 x 4.57 x 17.78mm
Minimum Operating Temperature
-55°C
Series
Economy 800
Maximum Operating Temperature
+105°C
Housing Material
PCT
Contact Material
Beryllium Copper
Country of Origin
Switzerland
Product details
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series
Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Open ladder for cooling, cleaning and inspection
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
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P.O.A.
12
P.O.A.
12
Technical documents
Specifications
Brand
TE ConnectivityNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold
Current Rating
3A
Orientation
Vertical
Length
50.8mm
Width
4.57mm
Depth
17.78mm
Dimensions
50.8 x 4.57 x 17.78mm
Minimum Operating Temperature
-55°C
Series
Economy 800
Maximum Operating Temperature
+105°C
Housing Material
PCT
Contact Material
Beryllium Copper
Country of Origin
Switzerland
Product details
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series
Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Open ladder for cooling, cleaning and inspection
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance