Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP

RS Stock No.: 741-9381Brand: WinslowManufacturers Part No.: W9594RC
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Technical documents

Specifications

Brand

Winslow

Pitch

0.5 mm, 2.54 mm

End 1

8 Pin Female SOP

End 2

8 Pin Male DIP

End 1 Number of Contacts

8

End 2 Number of Contacts

8

End 1 Type

SOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors

'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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P.O.A.

Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP

P.O.A.

Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP
Stock information temporarily unavailable.

Technical documents

Specifications

Brand

Winslow

Pitch

0.5 mm, 2.54 mm

End 1

8 Pin Female SOP

End 2

8 Pin Male DIP

End 1 Number of Contacts

8

End 2 Number of Contacts

8

End 1 Type

SOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Tin over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors

'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.