Hirose DF59 Series Male Crimp Terminal, 22AWG Max
Technical documents
Specifications
Brand
HiroseGender
Male
For Use With
DF59 Connector Housing
Series
DF59
Termination Method
Crimp
Maximum Wire Size mm²
0.3mm²
Contact Plating
Gold
Maximum Wire Size AWG
22AWG
Contact Material
Copper Alloy
Maximum Contact Resistance
30mΩ
Maximum Current
3A
Minimum Operating Temperature
-35°C
Maximum Operating Temperature
+105°C
Country of Origin
Japan
Product details
Hirose DF59 Crimp Contacts
Crimp contact for the Hirose DF59 series.
Hirose DF59 Series
The Hirose DF59 series features a low profile design that minimises shadowing and a positive swing-lock engagement, which provides strong plug retention against cable pull. Additionally, the Hirose DF59 series offers a floating board-to-board connector which allows ± 0.5mm floating function in XYZ directions, reducing contact stress. With the Hirose DF59 series, multiple board-to-board connections are possible, minimizing the issue of thermal expansion and reducing component quantity. Applications include LED lighting, power supplies, battery connection and small DC motor drives.
P.O.A.
Standard
1
P.O.A.
Standard
1
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Technical documents
Specifications
Brand
HiroseGender
Male
For Use With
DF59 Connector Housing
Series
DF59
Termination Method
Crimp
Maximum Wire Size mm²
0.3mm²
Contact Plating
Gold
Maximum Wire Size AWG
22AWG
Contact Material
Copper Alloy
Maximum Contact Resistance
30mΩ
Maximum Current
3A
Minimum Operating Temperature
-35°C
Maximum Operating Temperature
+105°C
Country of Origin
Japan
Product details
Hirose DF59 Crimp Contacts
Crimp contact for the Hirose DF59 series.
Hirose DF59 Series
The Hirose DF59 series features a low profile design that minimises shadowing and a positive swing-lock engagement, which provides strong plug retention against cable pull. Additionally, the Hirose DF59 series offers a floating board-to-board connector which allows ± 0.5mm floating function in XYZ directions, reducing contact stress. With the Hirose DF59 series, multiple board-to-board connections are possible, minimizing the issue of thermal expansion and reducing component quantity. Applications include LED lighting, power supplies, battery connection and small DC motor drives.