Technical documents
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
BGA Heatsinks
P.O.A.
AAVID THERMALLOY Heatsink, Universal Round Alu, 23.4°C/W, 28.58 (Dia.) x 9.14mm
1
P.O.A.
AAVID THERMALLOY Heatsink, Universal Round Alu, 23.4°C/W, 28.58 (Dia.) x 9.14mm
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| quantity | Unit price |
|---|---|
| 1 - 24 | P.O.A. |
| 25 - 99 | P.O.A. |
| 100 - 249 | P.O.A. |
| 250+ | P.O.A. |
Technical documents
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
