Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Brushless DC Motor Controller
Motor Type
Brushless
Configuration
3 Phase
Maximum IGBT Collector Current
600mA
Mount Type
Surface
Package Type
VFQFPN
Output Current
70mA
Pin Count
48
Minimum Supply Voltage
8V
Maximum Supply Voltage
45V
Minimum Operating Temperature
-40°C
Typical Switching Frequency
200kHz
Maximum Operating Temperature
150°C
Height
0.95mm
Length
7.1mm
Standards/Approvals
ANSI/ESDA/JEDEC JS-001-2014, ANSI/ESDA/JEDEC JS-002-2014
Width
7.1mm
Series
STSPIN
Supply Current
5mA
Automotive Standard
No
Product Details
The STSPIN32F0 is a System-In-Package providing an integrated solution suitable for driving three-phase BLDC motors using different driving modes. It embeds a triple half-bridge gate driver able to drive power MOSFETs or IGBTs with a current capability of 600 mA (sink and source). The high- and low-side switches of same half-bridge cannot be simultaneously driven high thanks to an integrated interlocking function. An internal DC/DC buck converter provides the 3.3 V voltage suitable to supply both the MCU and external components.
Stock information temporarily unavailable.
P.O.A.
1
P.O.A.
Stock information temporarily unavailable.
1
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Brushless DC Motor Controller
Motor Type
Brushless
Configuration
3 Phase
Maximum IGBT Collector Current
600mA
Mount Type
Surface
Package Type
VFQFPN
Output Current
70mA
Pin Count
48
Minimum Supply Voltage
8V
Maximum Supply Voltage
45V
Minimum Operating Temperature
-40°C
Typical Switching Frequency
200kHz
Maximum Operating Temperature
150°C
Height
0.95mm
Length
7.1mm
Standards/Approvals
ANSI/ESDA/JEDEC JS-001-2014, ANSI/ESDA/JEDEC JS-002-2014
Width
7.1mm
Series
STSPIN
Supply Current
5mA
Automotive Standard
No
Product Details
The STSPIN32F0 is a System-In-Package providing an integrated solution suitable for driving three-phase BLDC motors using different driving modes. It embeds a triple half-bridge gate driver able to drive power MOSFETs or IGBTs with a current capability of 600 mA (sink and source). The high- and low-side switches of same half-bridge cannot be simultaneously driven high thanks to an integrated interlocking function. An internal DC/DC buck converter provides the 3.3 V voltage suitable to supply both the MCU and external components.
